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WRIGHT-PATTERSON AIR FORCE BASE, Ohio – A collaboration between the Air Force Research Laboratory and American Semiconductor has produced a flexible silicon-on-polymer chip with more than 7,000 times the memory capability of any current flexible integrated circuit on the market today. The manufacturing takes advantage of flexible hybrid electronics, integrating traditional manufacturing techniques with 3D electronic printing to create thin, flexible semiconductors that can augment efforts in wearable technology, asset monitoring, logistics and more. (U.S. Air Force courtesy photo)
| Date Taken: | 12.21.2017 |
| Date Posted: | 12.21.2017 14:55 |
| Photo ID: | 4046791 |
| VIRIN: | 171221-F-ZS999-001 |
| Resolution: | 3008x1692 |
| Size: | 1.87 MB |
| Location: | WRIGHT-PATTERSON AIR FORCE BASE, US |
| Web Views: | 198 |
| Downloads: | 24 |
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