An artist's rendering of the new compound semiconductor laboratory and microsystem integration facility at the Massachusetts Institute of Technology's Lincoln Laboratory Campus on Hansom Air Force Base, Massachusetts. The Air Force Civil Engineer Center's Facility Engineering Directorate will lead the construction scheduled to be complete in 2025. The facility will consolidate the distributed compound semiconductor and advanced packaging laboratories into a single purpose-built building. (Courtesy graphic)
Date Taken: | 02.01.2022 |
Date Posted: | 02.08.2022 13:03 |
Photo ID: | 7030019 |
VIRIN: | 220130-F-ZZ988-602 |
Resolution: | 894x519 |
Size: | 68.08 KB |
Location: | HANSCOM AIR FORCE BASE, MASSACHUSETTS, US |
Web Views: | 7 |
Downloads: | 4 |
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